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Under pressure from trade sanctions put in place by the United States, Chinese Telecommunications Company Huawei is seeking to remain competitive by investing in innovation.
The company filed a patent application in the field of semiconductor packaging for a 'a type of chip stacking package and terminal device' which uses through-chip via technology (also known as through-silicon via or TSV).
The technology is expected to enable stacked chips to interconnect through direct contact, providing high-speed signal processing and improved photo detection for image sensing. One of the goals is to ease the disruptions caused by US chip sanctions on the firm's operations.
Tags chauds:
Commerce électronique et commerce
Infrastructures de télécommunications
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